描述
無描述配置
無配置OEM 代工型號說明
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.文檔
無文檔
BESI / ESEC
2007 HS
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
94781
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2007 HS
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
94781
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.文檔
無文檔