描述
無描述配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.文檔
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ASM
EAGLE XTREME GOCU
已驗證
類別
Bonders
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
76733
晶圓尺寸:
未知
年份:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME GOCU
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
76733
晶圓尺寸:
未知
年份:
2013
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.文檔
無文檔