EAGLE XTREME GOCU
類別
Bonders概述
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME die bonder that offers additional features and capabilities.
活躍中的上架商品
8
服務
檢驗、保險、評估、物流