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描述
無描述配置
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 代工型號說明
未提供文檔
無文檔
類別
Bonder/Debonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44844
晶圓尺寸:
12"/300mm
年份:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
類別
Bonder/Debonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44844
晶圓尺寸:
12"/300mm
年份:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 代工型號說明
未提供文檔
無文檔