描述
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available配置
無配置OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔
類別
Bonder/Debonder
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144932
晶圓尺寸:
8"/200mm
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
類別
Bonder/Debonder
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144932
晶圓尺寸:
8"/200mm
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available配置
無配置OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔