描述
Thermal Slide De-Bonder配置
無配置OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔
類別
Bonder/Debonder
上次驗證: 9 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144932
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
類別
Bonder/Debonder
上次驗證: 9 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144932
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Thermal Slide De-Bonder配置
無配置OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔