描述
無描述配置
無配置OEM 代工型號說明
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.文檔
無文檔
類別
AOI
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97677
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PARMI
XCEED MICRO
類別
AOI
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
97677
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.文檔
無文檔