描述
無描述配置
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 代工型號說明
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.文檔
無文檔
類別
AOI
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152851
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA FUSION 300
類別
AOI
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152851
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 代工型號說明
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.文檔
無文檔