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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS EXPIDA 1255S
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    OEM 代工型號說明
    The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.
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    THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

    EXPIDA 1255S

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    類別
    Analytical

    上次驗證: 超過60天前

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    產品編號:

    37941


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    年份:

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    THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

    EXPIDA 1255S

    verified-listing-icon
    已驗證
    類別
    Analytical
    上次驗證: 超過60天前
    listing-photo-2ba6b9c713e645c0b51058c664d98db4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    37941


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.
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