Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

SEMES

IRIS

K-SPIN12

K-SPIN8

EKPS 01

MICHELAN O3

LOZIX

LOZIX High

Feature:
Application for wafer size : 8”~12”
Contact accuracy: ±1㎛ (Advanced motion control technology)
Improvement of Loading Accuracy (Wafer change and align time reduction)
Stiffness Z-axis (1,000 kgf)
Precision temperature control (4℃@2,000W)
Application of auto leveling / securing the stability of contact (10㎛)
Self-diagnosis system (Life prediction, Pre-detection)
Auto card change (Side/front auto card change)
Advanced wafer & card automation (RGV, OHT, AGV)

SEMPRO PRIME

Feature:
Application for wafer size : 8”~12”
Contact accuracy : ±1㎛ (Advanced motion control technology)
Improvement of loading accuracy (Wafer change and align time reduction)
Stiffness Z-axis (250 kgf)
Application of auto leveling / securing the stability of contact (10㎛)
Auto card change (Side auto card change)

IP-300H

Test handler.
Feature:
Application : Memory package
High productivity : @3BIN, 512P 29,000 UPH
Temperature range : -60℃ ~ 160℃
Auto teaching (application of vision)
Vertical head docking system
Interface with various testers (Advantest, Teradyne and etc.)

STH-5800

Sorter
Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput (25,000 UPH)
Process : From dead bug (Ball up) to live bug (Ball down offloading)
Vision inspection : orientation, ball, mark, PKG align and side vision (optional)
Tray placement rate : 100% (RCPM)
Easy conversion and maintenance
Enhanced cleaning system (PVA and Bubble Jet)

SW6000 PLUS

Sorter
Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput and stability (45,000 UPH)
Process : Dead to Live, Dead to Dead available
Larger strip size (300mm x 120mm, 260mm x 200mm available)
Tray placement rate : 100% (RCPM)
Enhanced cleaning system (PVA and Bubble Jet)
Intelligent real-time monitoring system

TEPAS

SDB-3000MD

Sorter
Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput and stability (30,000 UPH)
Larger strip size (300mm x 120mm)
Tray placement rate : 100% (RCPM)
Enhanced cleaning system (PVA and Bubble Jet)
Intelligent real-time monitoring system (TBM & CBM)

SW9000U

SPE 300S

OMEGA-K

OMEGA-S

NANOSPIN

Single wafer cleaner for supercritical process.

SUPER CRYSTAL

LOTUS

Single wafer cleaner. 
Process performance:  
High grade process (19nm particle removal). 
Defect free technology.

Productivity / Hardware:
Contamination free clean by NIC bowl.
SF-aerosol : High velocity/uniformity droplet.
Smart system : APAC (Auto Flow Control). 
AIS (Auto Inspection System).
SEAS (Smart Equipment Analysis System).

BLUEICE PRIME

SWP3004

Single wafer cleaner for high-temp SPM process

BLUEICE SPM

K-WET300

Localized version of 300mm spin scrubber.

K-SCRUBBER12

K-WET

IRIS PRIME

SW9000

MICHELAN C4

Poly etcher.
Process performance:
Specialized for critical etch process (DRAM, V-NAND and Logic).
Fast etch / various control knobs for uniform etch rate.
High mask selectivity / high accuracy of CD control.
Low Particle / Vertical Etching.
Productivity / Hardware:
Cluster and quadra type transfer module : Max. 6 chambers.
ICP type etcher : high plasma density.
Exclusive ICP Source Antenna.
RF sync pulse function : high aspect ratio.
Multi-zone ESC heating and 3Z-tunable gas radial uniformity control.
Low cost and extended MTBC.

MICHELAN C3

Oxide etcher.
Process performance:
Specialized for critical etch process (DRAM, V-NAND and Logic).
Clean process / low Particle.
High etch rate / high mask selectivity.
Precise CD and CD uniformity control.
Vertical profile control and low micro-loading effect.

Productivity / Hardware:
Cluster transfer module : Max. 6 chambers.
Layout for easy maintenance.
RF sync pulse function for HARC etch.
Radial uniformity control HW : gas, temperature.
Precise & reliable process parameter control.
Low CoO / Long MTBC.

SEMES

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IRIS

K-SPIN12

K-SPIN8

EKPS 01

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