PANASONIC

SP28P-D	

HW22U-H

KXFW1KS5A00

RG132

KXFW1KS7A00

PANASERT IPV

BM221

CM602A

PANASERT RH6B

RL131

CM212

DMX401 Die Bonder, a cutting-edge semiconductor assembly tool engineered to elevate production efficiency and precision. With its multi-chip mounting function, the DMX401 enables seamless single-pass production of stacked dies and multi-chip packages, revolutionizing the packaging process. The bonding nozzle auto changer ensures swift transitions between bonding tasks, reducing downtime and maximizing output. Experience uninterrupted workflow with the automatic work pallet exchange during production, for a continuous and smooth work pallet supply

DMX401 

PANASERT AV NM-2011B

FCX501-L

N610064416AA

HW27B-T

MD-P200US

PSX303M	

HT122

HT132

DM21H-S

PC30B-H

he RH5 radial lead component insertion machine from Panasonic utilizes a guide pin system and V-shaped cutting of the lead tips to deliver high-density insertion at 0.29 s/piece. For efficient production, the RH5 also features an auto-recovery function that automatically corrects insertion errors along with other programming functions.

DT401-F

PANASERT MV2VB

RL132

Plasma Cleaner’s parallel plate chamber technology delivers superior etch uniformity over conventional batch systems. Experience surface cleaning before wirebond or flip-chip attach and surface activation and improved underfill wettability and mold encapsulation.

PSX307

MDP-300

HDF NM-DC10

PANASERT RH6S

E 626 I

MPAV2-XL

E725SC

PANASERT-RH3

RHU2

MPAV2A NM-15A

HDP-G1

Pick & Place / Feeders. 
This machine has the capability of using various kinds of components ranging from 0603 (0201")
chips to large ones (Max. 24 mm × 24 mm) such as PLCC, and also supports the bump
recognition of BGA/CSP as an option

CM202DS

KXFW1KS6A00

NPM-S

The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. 

UA3P-300

HRe- etch system, low-pressure, high-density plasma source, magnetic confinement.

MP-P200

E3000 metal etch (RIE), three chambers, etch, passivation, and dry strip.

E3000

The Panasonic AV132 is a high-speed axial lead component insertion machine that features a compact design and dense supply unit configuration. It has a performance of 30,000 CPH and can insert components in four directions: 0°, 90°, 180°, and 270°. The AV132 is designed to handle both ammo pack and reel and has a placement accuracy of ±40µm/chip (Cpk≧1). The dense supply unit configuration is available in 40 or 80 component inputs with optional jumper wire.

AV132

RHS2

Expendable parts of the RG131 such as the Anvil blade, lead cutter, chuck rubber and pusher rubber are compatible with those of the RHSG. The transfer system, the XY table, the controller and the driver can be used in any one of the Insertion machine series. The setup and maintenance operations are standardized.

RHSG

Meet the CM-402M, a cutting-edge pick-and-place machine that combines compactness with exceptional space productivity. Experience the power of ultrahigh-speed placement achieved through advanced multiple heads and a high-accuracy recognition system, ensuring swift and precise component placement. Embrace the intelligence of its feeder system, capable of handling five types of tape feeders, covering all tape variations with ease. The CM-402M allows digital feed pitch setting and records remaining parts count to provide timely alerts for parts replenishment. With its ability to handle up to 216 different component types on an 8 mm tape, the CM-402M is the epitome of efficiency and productivity for your manufacturing needs.

CM402-M

Panasonic’s SPG2 high-speed screen printing machine is tailored to SMT manufacturing. Equipped with multi-stage board handling improves productive time. SPG2's hybrid printing method delivers the right amount of solder with high-speed snap-off and reduced solder waste. 

SPG2

MSD021A1XX

AVK3

Interchangeable SMT placement machine brings flexibility to switch from ultra high-speed placement to multi-functionality on site. with its high speed head it can place up to 30,000 component per hour with a _+50 micron accuracy onto boards as large as 13" x 10". The multi-function head can place 8,750 cph with a _+35 micron accuracy. 

CM401

PANASERT RH2

AVK2B

MSD011A1XX

BM133

KXFW1KS8A00

NPM DSP

CM402A

PANASERT RH6

AV131

SP60

BM231

NPM-D2

PANASERT JVK NM-2037

FCX501-M	

HDF NM-DC15

SP18

HDP G3 NM-DB00A

DM22M-H

PANASERT SPPV

HDP V

NPM-W2.  Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.

NPM-W2

CM602

NPM-D3

DM60M-H

CM-602L, a highly versatile and efficient pick-and-place machine that revolutionizes electronics assembly. With abundant variations to choose from, tailor the machine to your specific product and production volume, accommodating everything from small chips to odd-shaped parts. The high-speed 12-nozzle head expands the parts range by an impressive 2.4 times, enabling lightning-fast placement of even □12 mm parts. Additionally, the general-purpose 8-nozzle head boasts enhanced abilities to handle odd-shaped components and supports 3D sensor integration and direct tray feeding. Experience improved area productivity with a downsized trolley and an optimized mounting sequence, boosting actual productivity by 8%. With high-speed detection using a 3D sensor and part thickness sensor, achieve top-notch quality during batch scanning of IC parts. The CM-602L's general-purpose transfer unit for POP and C4 mounting ensures accurate and efficient transfer of solder and flux. Enjoy seamless model switching and excellent compatibility with the CM402 series due to its innovative module design concept. Enhance your electronics manufacturing with the CM-602L, the epitome of precision, speed, and versatility.

CM602-L

Plasma Source: ICP Plasma
Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He )
Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.)
Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire
Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only)
Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only)
Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.]
N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / min

E600L

NPM-D3A

SMT process to accommodate more tray-supplied parts

NPM-TT2

CM402

NPM-W

For CM402-L, two PC boards can be clamped on one stage. (PC board length: 240 mm or less) When two PC boards are clamped, after the placement of the PC board on the downstream side is complete, that on the upstream side is carried out continuously. CM402-M/L has adopted the tape splicing feature, which allows supplying components while the placement machine is operating without stopping the placement operations. 
Model #: NM-EJM8A

CM402-L

E 620i

CM101-D

SP70

NM-SB50A

MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.

Die Bonder

MD-P200

SP60P-MU


The Panasonic HW27U-HF is a COB wire bonder optimized for expansive bonding areas, offering a rapid bonding speed of 0.15s/wire and a precise accuracy of ±5µm, ensuring flexibility and efficiency.

HW27U-HF

High Speed Screen Printer
• Fine printing 
• Easy operation 
• Main control boards are lead free 

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

PANASONIC

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