描述
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxide配置
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEM 代工型號說明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.文檔
無文檔
BENEQ
TFS 200
類別
ALD
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
150901
晶圓尺寸:
未知
年份:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxide配置
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEM 代工型號說明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.文檔
無文檔