概述

The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect: UPH 10% greater than the Maxµm on most applications + 2.5 µm accuracy at 3 sigma 35 µm ultra-fine-pitch process capability This yield-enhancing accessory consists of the following... Innovative Moving EFO Wand Technology Electronic Flame-Off from directly below the wire axis Specially designed, Fine-tipped EFO Wand and 8X Mag Optics ...resulting in these benefits: Improved Free Air Ball and Bonded Ball Concentricity Reduced "Small Ball" occurrence Better intermetalic coverage and higher bond strength Greater yield for ultra-fine-pitch processes A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.