8090
概述
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
活躍中的上架商品
1
服務
檢驗、保險、評估、物流
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
1
檢驗、保險、評估、物流