描述
Increase production efficiency by 30% Innovative optics and image preview systems for smaller chips Automatic material processing device makes product conversion faster ultra low line arc to 50 μ M larger wire range: 56mm x 70mm when the lead frame width is 80mm PR Look Ahead adopt windows operating system and intelligent user interface (multi language option配置
無配置OEM 代工型號說明
Wire Bonder文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79184
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79184
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Increase production efficiency by 30% Innovative optics and image preview systems for smaller chips Automatic material processing device makes product conversion faster ultra low line arc to 50 μ M larger wire range: 56mm x 70mm when the lead frame width is 80mm PR Look Ahead adopt windows operating system and intelligent user interface (multi language option配置
無配置OEM 代工型號說明
Wire Bonder文檔
無文檔