概述

Obducat’s high performance MC204 WET modular tool provides cutting-edge solutions for current and future R&D and low volume manufacturing (LVM) requirements. The configuration flexibility of the MC204 Wet makes it adaptable to processing requirements in wide variety of applications such as LEDs, SiC components, 5G components, Si IC’s, MEMS, Opto-electronic, Photonic components and Advanced Packaging. The system can handle substrate sizes from 2” to 8” Ø or 2” x 2“ to 6” x 6”.