The Disco DCS141 is a spinning unit that cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. It is appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, allowing cleaning with water and drying.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DCS141

CFM Technologies, INC

FullFlow 1/99 8100

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance

The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1440

Akrion focuses on multiple wet process solutions for semiconductor applications where high yield and low cost of ownership is a challenge. Each process step in device manufacturing presents an opportunity for contamination, which can result in defect formation and device failure, therefore critical cleaning is an integral part of our equipment’s capabilities.

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DCS141

FullFlow 1/99 8100

DCS1440

UP-V2 SA 3200