概述

The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.