8" model was imported as a new machine. Now it is in operation as a 8" dedicated machine.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.

DFG8360

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DISCO

DFG8360

Wafer Grinding

類似上架商品

DFG8360

Wafer Grinding

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