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描述
Installed and running Complete with no missing parts配置
Wafer Grinder for Silicon and Silicon Carbide, Spindle Upgrade Includes Disco DTU152 Water Temperature Control Unit 150mmOEM 代工型號說明
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.文檔
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DISCO
DFG8540
類別
Wafer Grinding
上次驗證: 17 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
124579
晶圓尺寸:
6"/150mm
年份:
2021
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描述
Installed and running Complete with no missing parts配置
Wafer Grinder for Silicon and Silicon Carbide, Spindle Upgrade Includes Disco DTU152 Water Temperature Control Unit 150mmOEM 代工型號說明
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.文檔
無文檔