描述
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Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM 代工型號說明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文檔
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DISCO
DAG810
類別
Wafer Grinding
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
119962
晶圓尺寸:
6"/150mm
年份:
2017
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描述
無描述配置
Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM 代工型號說明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文檔
無文檔