概述

The DAS8930 is a semi-automatic surface planer for Φ300 mm wafers, with 1 axis and 1 chuck table, manufactured by Disco Corporation1. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites, as well as solutions for reducing bump height variation and surface roughness.