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描述
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.配置
無配置OEM 代工型號說明
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KLA
FLX 2320A
類別
Thin Film / Film Thickness
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115322
晶圓尺寸:
未知
年份:
1993
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描述
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.配置
無配置OEM 代工型號說明
未提供文檔
無文檔