概述

The 8000S was designed to handle the round and square wafer-like pucks, typically 2 to 3 mm thick, which are used in the magnetic recording head industry. As in semiconductor manufacturing, magnetic recording head manufacturing involves a variety of deposition and patterning steps, some with requirements more stringent than those found in semiconductor manufacturing. In particular, magnetic recording head manufacturers are required to deposit more ultra-thin metal films than semiconductor manufacturers.