概述

The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.