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描述
無描述配置
無配置OEM 代工型號說明
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.文檔
無文檔
類別
Wafer Scrubber
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
68745
晶圓尺寸:
未知
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
ONTRAK DSS200 II
類別
Wafer Scrubber
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
68745
晶圓尺寸:
未知
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.文檔
無文檔