DTX-MDB 150
概述
The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
活躍中的上架商品
1
服務
檢驗、保險、評估、物流
