概述

With two parallelly arranged diamond precision cutting discs. Machine is suitable for squaring mono crystalline ingots with of work piece diameter of 150 - 230 mm (wafer format 125 x 125 mm or 156 x 156 mm). Segment lengths of 200 – 2500 mm can be processed. With water hydraulic guidance for thin diamond cutting discs as well as cutting force and automatic feed control.