概述

The W-SL-300 is a Wire Saw Slicing Machine that is designed for high-throughput slicing of plural wafers at a time. It is capable of slicing large-diameter ingots up to 300 mm, providing high-precision and high-processing quality while maintaining high-productivity. Additionally, the W-SL-300 is an economical machine with a small footprint and low running costs, making it an ideal choice for businesses looking to maximize their efficiency and productivity.