The Helios XP features an advanced temperature measurement and control system combined with an active compensation algorithm for different wafer emissivities. The Helios XP can fully satisfy technical requirements in manufacturing of different semiconductor devices across various technology nodes (130 nm to 5 nm and below). The Helios XP has also demonstrated high reliability, long mean-time-between-clean, and more than 20 to 30% benefit in overall cost of ownership in mass production. It is the ideal RTP system for advanced semiconductor development and manufacturing.

Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits. Supplier of plasma and rapid thermal processing (RTP) equipment to the global semiconductor industry, and operate in four primary product sectors: Dry Strip, Etch, Rapid Thermal Processing and Millisecond Anneal.

HELIOS XP

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