概述

The Applied Vantage Radiance RTP is a dedicated, two-chamber rapid thermal processing (RTP) solution for 300mm high-volume chip manufacturing. The Vantage system combines world-class Radiance 300mm RTP technology with a streamlined platform design to deliver industry-leading productivity and cost of ownership for 300mm volume manufacturing. The Vantage Radiance RTP interfaces up to two process chambers directly to the factory interface and track robot. Vantage maintains a <1 ppm oxygen ambient for critical anneals without the use of a mainframe or loadlock. The system supports all atmospheric annealing applications, including implant annealing, spike annealing and salicidation, as well as dry rapid thermal oxidation. Radiance chamber performance is equivalent to that on a Centura cluster tool, and Radiance technology and enhancements provide Vantage extendability to <90nm nodes. Mechanical throughput of the system exceeds 100 wafers per hour due to its simplified wafer transfer sequencing. Chipmakers quickly install and qualify the system as Vantage is delivered as a single, integrated unit. The Vantage platform has also demonstrated ease of maintenance and high reliability in volume production.