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SIGMA FXP 300
概述
The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD. The system includes modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers. The new system is designed to address the technical challenges customers face as they scale power PVD processes up to 300mm wafer size.
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