The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.