PICOSUN® P PEALD (Plasma Enhanced Atomic Layer Deposition) system is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

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Morpher P

PICOSUN Morpher F ALD product platform is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

Morpher F

R-200

The PICOSUN® P-1000 ALD system is designed for batch coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.

P-1000

he PICOSUN® P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones.

P-300BV

The PICOSUN® P-300B ALD system is specially designed for production of MEMS devices such as print heads, sensors, and microphones, and coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.

P-300B

The PICOSUN® Sprinter ALD system is designed to disrupt batch ALD production in 300 mm manufacturing lines in the semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component industries. In Sprinter, barrier, high-k oxide, and other films are deposited with perfect ALD in mass production volumes.

Sprinter

PICOSUN® Morpher T single wafer ALD system is designed to answer the requirements when quality, control and yield come before anything else, for the 200 mm wafer industries.  It also enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

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概述

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P-1000

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R-200

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Morpher F

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P-300BV

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