ENDURA® ALPS® PVD (ALPS CO & NI)
The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance silicide solution for gate and contact applications in high aspect ratio structures. Extending cobalt to ≤90nm technology nodes, ALPS technology produces good Co bottom coverage with no plasma damage to the device and very low defect counts. Endura ALPS Co addresses the challenges of titanium agglomeration, contact resistance change, and dopant suction through excellent resistivity, low leakage current, and thermal stability. 

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

ENDURA ALPS PVD

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