During fiscal 1999, Applied Materials purchased the remaining 50 percent of Applied Komatsu Technology, Inc. (AKT) that it did not previously own. 
AKT supplies equipment  for fabricating flat panel displays (FPDs) that are used in notebook PCs, desktop monitors, TVs and other applications. 

The Applied Materials AKT1600 is a panel etcher and panel deposition tool with four loading ports, two vacuum load locks, and five chambers. Two chambers (A and B) are designated for etching, processing a maximum of two panels at a time. Etch Chamber A is used primarily for etching silicon nitrate (SiN) while Etch Chamber B is used to etch aluminum (Al), molybdenum (Mo), indium tin oxide (ITO) and amorphous silicon (a-Si). The three deposition chambers are single panel chambers. Chamber D is used to deposit SiN and a-Si. Chamber C is used to deposit material doped n-type and chamber E to deposit materials doped p-type although both chambers can also deposit un-doped amorphous silicon. The AKT 1600 plasma enhanced chemical vapor deposition (PECVD) system is a powerful vacuum system used to convert reactive gaseous species into a solid film. With its advanced capabilities and versatility, the AKT 1600 PECVD system is an essential tool for the fabrication of high-quality solar cells.

APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)

1600 PECVD

AKT-55K PECVD(2,200mm x 2,500mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

55K PECVD

AKT-40K PECVD(1,950mm x 2,250mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

40K PECVD

AKT-50K PECVD(2,160mm x 2,460mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

50K PECVD

AKT-4300 PECVD(620mm x 750mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers


4300 PECVD

AKT-15K PECVD(1,200mm x 1,300mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

15K PECVD

AKT-20K PECVD(1,300mm x 1,500mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

20K PECVD

AKT-5500 PECVD(730mm x 920mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

500 PECVD

AKT-10K PECVD(1,000mm x 1,200mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

10K PECVD

3500 PECVD

AKT-25K PECVD(1,500mm x 1,850mm)
PECVD systems deposit doped and undopedamorphous silicon, silicon nitride, silicon oxide and oxynitride
PECVD systems deposit films on glass substrates more than 70 times larger than 300mm wafers

APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)

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1600 PECVD

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