Machining of compounds such as silicon wafers, SiC wafers, GaN, GaAs, LT, An, etc.
Wafer size: 2-6"

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*



W-GM-4200E-26

類別

概述

活躍中的上架商品

服務

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