Compatible with Φ12 inch large diameter wafers. 
High precision, low damage grinding (notch / outer circumference).
Compatible with various host communication specifications.

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*



W-GM-5200E

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