Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.

CENTURA Silvia Etch

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描述

配置

OEM 代工型號說明

文檔

CENTURA Silvia Etch

Plasma Etch

關鍵商品詳情

類似上架商品

CENTURA Silvia Etch

Plasma Etch

關鍵商品詳情

描述

配置

OEM 代工型號說明

文檔

類似上架商品

CENTURA Silvia Etch