Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The AMAT / APPLIED MATERIALS Centura IPS (induced plasma source) is a dialectric etch system. This AMAT Centura is configured with Inductively Coupled Parallel Plate Semiconductor Dielectric Etch (IPS) chamber. The IPS chamber can be used alone or with other chambers on the Centura platform. The AMAT / APPLIED MATERIALS Centura IPS can be configured for wafer sizes up to 300mm. Applications for the AMAT / APPLIED MATERIALS Centura IPS include etching dual damascene structures in copper-based devices.

APPLIED MATERIALS (AMAT)

CENTURA IPS

Dry / Plasma Etch

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CENTURA IPS

Dry / Plasma Etch

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