描述
無描述配置
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM 代工型號說明
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.文檔
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APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
已驗證
類別
Plasma Etch
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103686
晶圓尺寸:
未知
年份:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
已驗證
類別
Plasma Etch
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103686
晶圓尺寸:
未知
年份:
2002
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM 代工型號說明
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.文檔
無文檔