概述

• Simultaneous measurement of 3-channel photoluminescence and 1-channel DIC laser microscopy using a 355nm laser source • Deep learning for defect analysis • DIC Laser Microscopy Surface Inspection – Reflected DIC laser microscope of excitation source (355nm) – Carrot, Scratch, Droplets, 3-C triangular defects • Band edge PL inspection method, additional 2 types of data for user reference – BPD, Shockley stacking faults, Bar type stacking faults • Photoluminescence spectral mapping with spectrometer – Whole wafer mapping – Spectroscopic analysis for aimed area in map data • Auto-Navigation Function – Auto-defect inspection using spectral measurement using PMT mapping and image processing result – Exact stacking faults classification by spectrum analysis