Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The AMAT / APPLIED MATERIALS P 5000 MARK II MXP R2 is a Etchers & Ashers system. The P 5000 MARK II MXP R2 can produce wafer size of 8”.

APPLIED MATERIALS (AMAT)

P5000 MARK II MXP R2

Photolithography

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P5000 MARK II MXP R2

Photolithography

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