描述
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though配置
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔
類別
PECVD
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
137095
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100
類別
PECVD
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
137095
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though配置
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔