CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.

CYBER OPTICS

SE300 Ultra

• Field Proven 3D Vision Sensing Technology
• High Resolution 3D sensing technology
• Built-in Fiducial camera & lighting
• Great for Demanding Assemblies
• 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes
• 3D shaded view for examining solder paste deposits
• Registration Measurement
• Bridge Detection for Fine Tune printer setup/monitor process drift
• XML format output
• Adjustable-width, clamping conveyor systems
• CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive

• Dimensions (h x w x d) 200 x 98 x 125
• Weight 860 kg (1900 lbs.)
• Panel Size Capacity:
  Maximum 508 x 508 mm (20 x 20 in.)
  Minimum 101 x 40 mm (4 x 1.5 in.)
• Maximum Panel Weight:  3 kg (6.6 lb.)
• Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.)
• Board Edge Clearance: Top 2.5 mm (0.10 in.)  Bottom 3 mm (0.12 in.)
• Underside Component Clearance: 25.4 mm (1 in.)
• Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec)
• Conveyor Height: 889 to 990 mm (35 to 39 in.)
• Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II
• Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.)
• Maximum Pad Size:  in 5 x 10 mm
• FOV (0.197 x 0.394 in.)

SE300 Ultra

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