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TEIKOKU ATM-800X
    描述
    Pasting machine
    配置
    無配置
    OEM 代工型號說明
    -Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.
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    TEIKOKU

    ATM-800X

    verified-listing-icon

    已驗證

    類別
    Packaging

    上次驗證: 2 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    94157


    晶圓尺寸:

    未知


    年份:

    2004

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    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    TEIKOKU

    ATM-800X

    verified-listing-icon
    已驗證
    類別
    Packaging
    上次驗證: 2 天前
    listing-photo-4044e8c91cfc434c99b6d103c84eba32-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    94157


    晶圓尺寸:

    未知


    年份:

    2004


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Pasting machine
    配置
    無配置
    OEM 代工型號說明
    -Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.
    文檔

    無文檔

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