描述
無描述配置
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM 代工型號說明
LASER文檔
無文檔
TEIKOKU
DXL 800HS
已驗證
類別
Packaging
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17902
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEIKOKU
DXL 800HS
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17902
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM 代工型號說明
LASER文檔
無文檔
類似上架商品
查看全部無類似上架商品