概述

Protective tape remover for 12-inch (300 mm) wafers. Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room. Holding a wafer precisely with a unique wafer table and removing the protective tape without giving stress. Interactive mode allows easier operation. (Option) FOUP cassette, AGV and OHT protocol, built-in UV radiation unit.