DR 3000III
概述
Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.
活躍中的上架商品
0
服務
檢驗、保險、評估、物流
Messages
Messages
Messages including contact info may not be shared. We scan, review, and reserve the right to remove sensitive information from all messages to prevent fraud and policy violations.All messages subject to review, review our policy for more info.
