描述
無描述配置
Wafer loading / unloading, Fro 4", 6" and 8" wafer (thickness 150 um or more), Ring frame load / attachment, Capable frame size (DISCO MODT2-8-1 and MODTF2-6-1), Capable frame cassette (DISCO MODT2-8-1 and MODTF2-6-1), Wafer table Levelling Jig, Thrubeam type fiber sensor for tape detection, Attachment accuracy X,Y ; within +/- 0.5 mm, Attachment accuracy theta within +/- 0.5 d, CE Mark and EMC conformity, Signal Tower, ManualOEM 代工型號說明
LINTEC RAD-2500 F/8 is a Packaging system. The RAD-2500 F/8 is a 200mm Fully-Automatic Wafer Mounter system. its Max throughput is over 100 wafers per hour.文檔
無文檔
LINTEC
RAD-2500 F/8
已驗證
類別
Packaging
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
20386
晶圓尺寸:
4"/100mm, 6"/150mm, 8"/200mm
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LINTEC
RAD-2500 F/8
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
20386
晶圓尺寸:
4"/100mm, 6"/150mm, 8"/200mm
年份:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Wafer loading / unloading, Fro 4", 6" and 8" wafer (thickness 150 um or more), Ring frame load / attachment, Capable frame size (DISCO MODT2-8-1 and MODTF2-6-1), Capable frame cassette (DISCO MODT2-8-1 and MODTF2-6-1), Wafer table Levelling Jig, Thrubeam type fiber sensor for tape detection, Attachment accuracy X,Y ; within +/- 0.5 mm, Attachment accuracy theta within +/- 0.5 d, CE Mark and EMC conformity, Signal Tower, ManualOEM 代工型號說明
LINTEC RAD-2500 F/8 is a Packaging system. The RAD-2500 F/8 is a 200mm Fully-Automatic Wafer Mounter system. its Max throughput is over 100 wafers per hour.文檔
無文檔