描述
Automatic Injection Molded Solder Mold Filling tool配置
Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, automated injection molded solder mold filling tool.deposit solder in mold openings in the front face of molds.Input and output ports (Mold Load Ports, or MLPs) which will allow mold carts to dock tothe equipment in order to load and unload molds.OEM 代工型號說明
未提供文檔
無文檔
SUSS MicroTec / KARL SUSS
HVMMFT
已驗證
類別
Packaging
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13886
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部無類似上架商品
SUSS MicroTec / KARL SUSS
HVMMFT
已驗證
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13886
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Automatic Injection Molded Solder Mold Filling tool配置
Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, automated injection molded solder mold filling tool.deposit solder in mold openings in the front face of molds.Input and output ports (Mold Load Ports, or MLPs) which will allow mold carts to dock tothe equipment in order to load and unload molds.OEM 代工型號說明
未提供文檔
無文檔
類似上架商品
查看全部無類似上架商品